Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

V to AI-driven manufacturing and startup-led innovation, Sharat Kaul of the International Electronics Manufacturing ...

How can power modules be manufactured to reliably function under increasing power densities, higher temperatures and new ...